Introduction to Core Parameters of Fenghua Thin Film Resistors

Analysis of Core Parameters of Fenghua Thin Film Resistors
Fenghua High tech Thin Film Resistors have the core advantages of high precision, high stability, and miniaturized design, and are widely used in high-end fields such as precision instruments, 5G communication, and automotive electronics. The following focuses on its core parameters and technical highlights from four dimensions: resistance characteristics, temperature stability, power tolerance, and environmental adaptability:
1、 Resistance characteristics: precise and flexible balance
Resistance range and accuracy level
Coverage: Supports nominal resistance values ranging from 1 Ω to 10M Ω, matched with high-precision resistance systems such as E96 and E192, with an error as low as ± 0.1% (0.01% accuracy level), meeting the requirements of ADC reference voltage, precision sampling, and other scenarios.
Adjustable resistance: Through laser resistance adjustment technology, the resistance can be fine tuned with an accuracy of 0.1%, supporting customized resistance design.
Temperature coefficient of resistance (TCR)
Low temperature drift characteristics: The mainstream product TCR is controlled within ± 5ppm/℃ (some high-end models can reach ± 2ppm/℃), significantly better than thick film resistors (± 100ppm/℃), ensuring minimal temperature fluctuations in resistance.
Material optimization: Using alloy systems such as nickel chromium (NiCr) and manganese copper (MnCu), TCR customization can be achieved by adjusting the composition ratio (such as Ni80Cr20, Mn75Cu25, etc.).
2、 Temperature stability: reliable guarantee in extreme environments
Working temperature range
Industrial grade: -55 ℃~+155 ℃, covering the vast majority of industrial scenarios;
Vehicle specification level: -55 ℃~+175 ℃, certified by AEC-Q200, meeting high temperature environmental requirements such as engine compartment and battery management system.
Thermal shock resistance
After 1000 cycles of impact from -55 ℃ to+155 ℃, the resistance change rate is ≤± 0.02%, which is suitable for scenarios such as aerospace and military industries that require frequent alternation of hot and cold.
3、 Power tolerance and electrical stability
power rating
Package size and power matching:
0402 package (0.4 × 0.2mm): 0.063W
2512 package (6.3 × 3.1mm): 1W
Pulse load capacity: capable of withstanding a single pulse impact of 10 times the rated power, suitable for pulse load scenarios such as switching power supplies and motor drives.
Long term stability
Load life test: operate continuously for 2000 hours at rated power, with a resistance change rate of ≤± 0.1%;
Damp heat stability: After passing the 85 ℃/85% RH damp heat test for 1000 hours, the resistance deviation is ≤± 0.05%, meeting the requirements of high humidity environments such as outdoor equipment and medical electronics.
4、 Packaging and miniaturization: breakthroughs in space and performance
Ultra miniature packaging
We provide micro packages such as 0201 (0.25 × 0.125mm) and 0402, with the 0201 package weighing only 0.001g, which helps to miniaturize terminals such as smartphones and wearable devices.
Optimization of electrode structure
Adopting a three-layer metal electrode (Ti/Pt/Au), the pad adhesion is ≥ 5N, and the sulfur resistance is excellent, ensuring welding reliability and long-term stability.
5、 Application scenarios and parameter associations
Precision measurement circuit: relying on low TCR (± 5ppm/℃) and high accuracy (± 0.1%), such as medical instruments and industrial sensors;
High frequency communication module: With low parasitic inductance (0.1nH) and miniaturized packaging, suitable for 5G base stations and RF front-end;
Automotive electronic system: certified by AEC-Q200, capable of withstanding temperatures ranging from -55 ℃ to+175 ℃, ensuring stable operation of key components such as ECU and BMS.
Summary: Fenghua thin film resistors have built a full chain technological advantage from materials to processes through four core parameters: resistance accuracy, low-temperature drift, high power tolerance, and miniaturized packaging, becoming the preferred component for high-end electronic devices. The specific selection should be based on the application scenario, referring to the detailed electrical performance curve and reliability test report in the official data manual.