What kind of circuit will use AC-DC chips?

Complete Analysis of AC-DC Chip Application Circuits: A Technical Graph from Infrastructure to Frontier Scenarios
As the core component of power conversion, AC-DC chips have applications in a wide range of fields, from consumer electronics to industrial equipment. This article combines the characteristics of chip technology and market demand to outline the typical application circuits and design points of AC-DC chips for you.
1、 In the field of consumer electronics: balancing high efficiency and miniaturization
Mobile phone/laptop adapter circuit
Core requirement: Support PD fast charging protocol (such as 65W/100W) to achieve high power density design.
Typical circuit: Using PI InnoSwitch series or Southchip SC3056 chip, integrating gallium nitride (GaN) power devices, and reducing the number of peripheral components through encapsulation technology.
Design points:
The standby power consumption should be less than 30mW and meet the Level 6 energy efficiency standard;
Adopting valley opening technology to reduce switch losses and increase efficiency by 2% -3%;
Integrate multi protocol support (such as PD3.1/QC5.0) to achieve single or multi port fast charging.
Router/set-top box circuit
Core requirements: High precision constant voltage output (± 3%) and low standby power consumption.
Typical circuit: using Jingfeng Mingyuan BP6216 or Infineon ICE2PCS01G chip, with built-in high-voltage starting circuit and protection function.
Design points:
Supports wide voltage input (90-264VAC), adapting to global power grid standards;
Integrated EMI filtering circuit, meeting EN55032 electromagnetic compatibility standard;
Remote parameter tuning is achieved through digital control interfaces such as I2C.
2、 Industrial and commercial equipment field: high reliability and wide temperature adaptability
Industrial power circuit
Core requirement: Supports CCM/QR/DCM multi-mode control and can withstand a wide temperature range of -40 ℃ to 125 ℃.
Typical circuit: Using Texas Instruments UCC28780 or Anson Mei NCP13992 chips, integrated with high-voltage startup and protection functions.
Design points:
Built in overvoltage protection (OVP), overcurrent protection (OCP), and over temperature protection (OTP) triple protection;
Adopting critical conduction mode (CrM) to optimize the balance between efficiency and EMI performance;
Through high reliability testing (such as MTBF exceeding 100000 hours).
Communication base station circuit
Core requirements: High efficiency (>95%) and high power factor (PFC>0.95).
Typical circuit: using Infineon CoolSET series or Jewat JW1550 chip, integrated PFC+LLC two in one control.
Design points:
Support the 80Plus titanium energy efficiency standard to reduce operating costs;
Using gallium nitride (GaN) power devices to achieve high-frequency (1MHz) driving;
Integrated digital control interface, supporting remote monitoring and fault diagnosis.
3、 Automotive Electronics: Safety Certification and Extreme Environment Adaptation
Car charger (OBC) circuit
Core requirement: Passed AEC-Q100 certification and supports bidirectional charging and discharging.
Typical circuit: Using Infineon CoolSET CE or Southchip SC3056 automotive grade chips, with built-in 1200V SiC MOSFET.
Design points:
Capable of withstanding a temperature range of -40 ℃ to 105 ℃, suitable for high temperature environments in the engine compartment;
Integrated ASIL-D-level fault detection, meeting ISO 26262 functional safety standards;
Support bidirectional energy transfer (V2G/V2L), suitable for new energy vehicle application scenarios.
Automotive Electronic Control Unit (ECU) Circuit
Core requirements: High reliability power supply and anti-interference ability.
Typical circuit: using Texas Instruments UCC28910 or Jewat JW1515 chips, integrated with digital control interface.
Design points:
Passed IEC 61000-4-2 ESD test (8kV contact discharge);
Built in soft start circuit to reduce startup surge current;
Supports wide voltage input (6V-36V) to adapt to voltage fluctuations in automobiles.
4、 Emerging fields: technology integration and scenario innovation
Data center power circuit
Core requirements: High efficiency (>96%) and high power density (>0.5W/cm ³).
Typical circuit: Using Jewate JW1550 or Jingfengmingyuan BP8706D chips, integrated with gallium nitride (GaN) power devices.
Design points:
Support high-frequency (1MHz) driving to reduce transformer volume;
Using LLC resonance technology to achieve zero voltage switching (ZVS);
Integrated digital control interface, supporting PMBus communication protocol.
IoT device circuit
Core requirements: Ultra low standby power consumption (<10mW) and multi protocol support.
Typical circuit: using the English chip IP2736 or the chip SM7012 from Xinpeng Micro, integrated with Bluetooth/Wi Fi protocols.
Design points:
Adopting pulse frequency modulation (PFM) technology to reduce standby power consumption;
Support multi port power allocation algorithm and adapt to USB-C/USB-A hybrid interfaces;
Passed EN 62368-1 safety certification and meets consumer electronics standards.
Medical equipment circuit
Core requirement: High precision isolated power supply and medical safety standards.
Typical circuit: Using ON Semiconductor NCP13992 or Texas Instruments UCC28780 chip, integrated isolation transformer.
Design points:
Meets the IEC 60601 medical safety standard, with a leakage current of<100 μ A;
Adopting a flyback topology to achieve electrical isolation between input and output;
Built in overvoltage/overcurrent protection to meet the high reliability requirements of medical equipment.
5、 The impact of technological trends on circuit design
Application of Gallium Nitride (GaN) and Silicon Carbide (SiC):
High frequency (>1MHz) driving capability reduces transformer volume by 50%;
Low on resistance (<10m Ω) improves efficiency to over 98%.
Integration of digitalization and intelligence:
Built in ARM Cortex-M0 core for real-time load monitoring and dynamic adjustment;
Support remote parameter tuning and fault diagnosis through I2C/PMBus interface.
Modular and integrated design:
The sealing technology integrates PFC controller, PWM controller, and synchronous rectifier tube into a single chip;
Modular power supply design simplifies PCB layout and reduces production costs.
6、 Future Circuit Design Direction
AI powered intelligent power supply:
The machine learning algorithm is used to predict the load change, and the output voltage is adjusted in advance. The efficiency is improved by 1% -2%.
Wireless charging integration:
Combining magnetic coupling resonance technology to achieve integrated design of AC-DC conversion and wireless charging.
Bidirectional energy transfer:
Support bidirectional flow of electrical energy, suitable for V2G (vehicle to grid) and V2H (vehicle to home) application scenarios.
The application circuits of AC-DC chips are expanding from traditional consumer electronics to high value-added fields such as industry, automotive, and data centers. With the application of new materials such as gallium nitride and silicon carbide, as well as the integration of digital and intelligent technologies, the future power supply design will present a trend of higher efficiency, smaller size, and stronger intelligence.