Complete Analysis of AC-DC Chip Functions: Multiple Abilities from Basic Conversion to Intelligent Control
As the core component of power management, AC-DC chips have evolved from traditional voltage conversion to a system level solution that integrates efficient conversion, intelligent protection, and protocol support. This article reveals the diverse capabilities of AC-DC chips from three dimensions: basic functions, scenario based functions, and technology integration functions.
1、 Basic function: Efficient and stable power conversion
Voltage Conversion and Stabilization
Wide voltage input: Supports 90V-264VAC global power grid standards and adapts to fluctuations in power grids in different countries.
Multi channel output: Integrated synchronous rectification technology to achieve independent voltage regulation outputs of 5V/12V/24V and other multiple channels, meeting the requirements of complex systems.
Dynamic response: By using fast load response technology, ensure that the output voltage fluctuation is less than ± 1%, and adapt to transient load scenarios such as CPU and GPU.
Power Factor Correction (PFC)
High power factor: Built in PFC control circuit increases the power factor to above 0.95, reducing harmonic pollution in the power grid.
Critical conduction mode (CrM): For example, the ON Semiconductor NCP1342 chip optimizes efficiency and balances EMI performance through CrM control.
Energy efficiency optimization
Light load frequency reduction: automatically reduces the switching frequency during standby or low load, with standby power consumption<75mW, meeting the Level 6 energy efficiency standard.
Bottom opening: For example, the PI InnoSwitch series reduces switch losses and increases efficiency by 2% -3% through bottom opening technology.
2、 Scenario based functionality: deeply adapted to industry needs
Consumer electronics scene
Fast charging protocol support: integrates PD3.1, QC5.0 and other protocols, supports 240W high-power output, such as the Nanxin SC3056 chip.
Miniaturization design: using gallium nitride (GaN) power devices, reducing the volume by 50%, suitable for mobile phone and laptop adapters.
Industrial scene
Wide temperature operation: able to withstand temperatures ranging from -40 ℃ to 125 ℃, such as the Texas Instruments UCC28780 chip, suitable for outdoor communication base stations.
High reliability protection: Integrated overvoltage protection (OVP), overcurrent protection (OCP), and over temperature protection (OTP) triple protection, MTBF exceeding 100000 hours.
Automotive electronic scene
Vehicle grade certification: Passed AEC-Q100 certification, such as the Infineon CoolSET CE chip, meets automotive grade vibration, impact, and humidity requirements.
Functional safety support: Integrated ASIL-D-level fault detection, such as the Jewat JW1550 chip, compatible with autonomous driving domain controllers.
3、 Technology integration function: intelligent and digital upgrading
Digital Control Interface
I2C/PMBus communication: such as TI UCD3138 chip, supports digital loop compensation and remote parameter tuning, simplifying system debugging.
Adaptive control: Through the built-in ARM Cortex-M0 core, real-time monitoring of input voltage and load changes, and dynamic adjustment of working modes.
integrated design
Sealing technology: Integrating PFC controller, PWM controller, and synchronous rectifier tube into a single chip, such as PI InnoSwitch Family, to reduce the number of peripheral components.
Modular power supply: such as the Infineon CoolSET series, which has built-in MOSFETs and driver circuits, can directly drive transformers, simplifying PCB design.
Application of new materials
Gallium Nitride (GaN): The Nanxin SC3056 chip uses GaN power devices with a switching frequency of 1MHz and an increased power density of 1.5W/cm ³.
Silicon carbide (SiC): Infineon CoolSET CE chip has a built-in 1200V SiC MOSFET with an efficiency of 96%, suitable for automotive OBC scenarios.
4、 Future functional evolution direction
AI powered intelligent power supply
The machine learning algorithm is used to predict the load change, and the output voltage is adjusted in advance. The efficiency is improved by 1% -2%.
Wireless charging integration
Combining magnetic coupling resonance technology to achieve integrated design of AC-DC conversion and wireless charging, such as the upgraded version of the Xinpeng Micro SM7505.
Bidirectional energy transfer
Support bidirectional flow of electrical energy, such as the Nanxin SC3056 vehicle grade chip, suitable for V2G (vehicle to grid) application scenarios.
The function of AC-DC chips has evolved from a single voltage conversion to a system level solution that integrates efficient conversion, intelligent protection, protocol support, and digital control. With the application of new materials such as gallium nitride and silicon carbide, as well as the integration of AI and IoT technologies, future power management will present a trend of higher efficiency, smaller size, and stronger intelligence.