What are the application scenarios of DC-DC chips?

As the core device of power management, DC-DC chips have a wide range of application scenarios, from consumer electronics to industrial control. From seven dimensions of consumer electronics, communication equipment, industrial control, automotive electronics, medical equipment, aerospace, and emerging technologies, combined with specific cases and technical requirements, analyze their core application scenarios:
1、 Consumer Electronics: Balancing Portability and High Efficiency
1. Smartphones and tablets
Requirements: Ultra thin design, fast charging support, long battery life.
DC-DC applications:
Voltage reducing chip: Reduce the battery voltage (3.7V~4.2V) to the CPU/GPU core voltage (0.5V~1.2V).
Charge pump chip: realizes high-voltage fast charging (such as 10V/5A input, 5V/10A output).
Typical case: The Apple A-series chip uses TI TPS62840 (96% efficiency, 1 μ A static current).
2. Wearable devices
Requirements: miniaturization, low power consumption, long standby time.
DC-DC applications:
Ultra low power chip: such as BiYi Micro KP3114 (0.5 μ A static current).
Wireless charging receiver chip: Integrated DC-DC conversion, supports Qi standard.
Typical case: Xiaomi Mi Band adopts Nanxin SC8551 (98% efficiency, supports 20W wireless charging).
2、 Communication equipment: high reliability and high power output
1. 5G base station
Requirements: Wide voltage input, high efficiency, thermal management.
DC-DC applications:
Isolation type DC-DC module: converts -48V input to 12V/5V, supports PoE++power supply.
Digital power chip: dynamically adjusts output voltage through I ² C interface to optimize energy efficiency.
Typical case: Huawei 5G base station adopts ADI LTC7821 (100V input, 15A output, 98% efficiency).
2. Optical modules and routers
Requirements: High precision power supply, low noise, fast response.
DC-DC applications:
Low Dropout Linear Regulator (LDO): Provides<1mV ripple voltage for optical module lasers.
Multiphase controller: Supports CPU core power supply, dynamic response time<1 μ s.
Typical case: Cisco routers use TI TPS54302 (output voltage accuracy ± 1%).
3、 Industrial control: environmental resistance and high stability
1. Industrial robots
Requirements: Wide temperature operation, vibration resistance, long lifespan.
DC-DC applications:
Vehicle grade chips: such as Infineon OptiMOS ™ Series (-40 ℃~+150 ℃ temperature range).
Redundant design: Dual DC-DC parallel connection, automatic switching in case of single channel failure.
Typical case: ABB industrial robots use the Jewat JW5033 (supporting a temperature range of -55 ℃ to+125 ℃).
2. PLC and sensors
Requirements: Small size, high reliability, low EMI.
DC-DC applications:
Micro packaged chips: such as SGMicro SGM6132 (3A output, 2mm x 2mm package).
Filter circuit integration: Built in LC filter, compliant with CISPR 22 Class B standard.
Typical case: Siemens PLC adopts SIRIP TPS54302 (anti-interference ability>30V transient voltage).
4、 Automotive Electronics: Balancing Safety and Durability
1. Electric vehicle BMS
Requirements: High precision voltage sampling, fast response, and functional safety.
DC-DC applications:
Isolation type DC-DC module: provides safe isolation power supply for the battery management unit.
ASIL-D certified chip: such as Infineon TLE9262 (compliant with ISO 26262 standard).
Typical case: Tesla Model 3 adopts TI TPS62840 (1 μ A static current, extended standby time).
2. In car entertainment system
Requirements: Multi voltage output, low noise, fast startup.
DC-DC applications:
Multi channel chip: such as ADI LTC3884 (4-channel output, supports sequential startup).
Soft start function: to avoid power shock and protect loads such as the display screen.
Typical case: The BMW iDrive system adopts the Southchip SC8551 (supporting 20V input, 98% efficiency).
5、 Medical equipment: high precision and low leakage
1. Imaging equipment (CT/MRI)
Requirements: ultra-low noise, high stability, biocompatibility.
DC-DC applications:
Linear regulator: Provides<0.1mV ripple voltage to the detector.
Medical grade certified chips: such as Shengbang Micro SGM2019 (compliant with IEC 60601 standard).
Typical case: GE Medical CT machine adopts ADI LTC7821 (100V input, 15A output).
2. Portable medical devices
Requirements: miniaturization, low power consumption, high reliability.
DC-DC applications:
Micro packaged chip: such as BiYi Micro KP3114 (0.5 μ A static current).
Battery management chip: integrates DC-DC conversion and power metering functions.
Typical case: The Yuyue blood pressure monitor uses Jingfeng Mingyuan BP85221 (integrated MOSFET, supports 24V input).
6、 Aerospace: Lightweight and High Reliability
1. Satellite power system
Requirements: High efficiency, radiation resistance, and long lifespan.
DC-DC applications:
Radiation hardening chip: such as TI TPS7H1101-SP (resistant to total dose radiation>100krad).
High power density design: Package volume<1cm ³, supports 100V input.
Typical case: The Beidou navigation satellite adopts ADI LTC3884 (4-channel output, supports sequential startup).
2. Drones and Missiles
Requirements: Fast transient response, shock resistance, lightweight.
DC-DC applications:
High frequency switch chip: such as Infineon IR3899 (2MHz switching frequency, reducing filtering components).
Ceramic packaging: anti vibration ability>50g.
Typical case: DJI unmanned aerial vehicle adopts Nanxin SC8551 (supporting 20V input, 98% efficiency).
7、 Emerging Technologies: Breakthrough in Energy Efficiency and Integration
1. Artificial Intelligence (AI) Server
Requirements: High power density, dynamic load response, thermal management.
DC-DC applications:
48V to 1V multiphase controller: supports output currents above 1000A.
Digital power management: Monitor voltage, current, and temperature through PMBus interface.
Typical case: NVIDIA DGX A100 adopts TI TPS546B24A (16 phase control, 96% efficiency).
2. Internet of Things (IoT) nodes
Requirements: ultra-low power consumption, miniaturization, self powering.
DC-DC applications:
Energy harvesting chip: such as e-peas AEM10941 (extracting energy from photovoltaic/thermoelectric conversion).
Ultra low static current:<100nA, extending battery life.
Typical case: Amazon Sidewalk devices use BiYi Micro KP3114 (0.5 μ A static current).
Summary: Selection Logic and Trends
Performance priority scenarios (such as AI servers, 5G base stations):
Selection focus: high efficiency (>95%), high power density, digital control interface.
Typical brands: TI, ADI, Infineon.
Cost sensitive projects (such as IoT, consumer electronics):
Selection focus: Low cost (<0.5 USD), micro packaging, ultra-low power consumption.
Typical brands: Shengbangwei, Jingfengmingyuan, Biyiwei.
Special environmental requirements (such as automotive electronics, aerospace):
Selection focus: AEC-Q100 certification, radiation resistance, and wide temperature operation.
Typical brands: Infineon, Jewat, and Nanxin.
Emerging technology trends:
GaN/SiC material: increases switching frequency and reduces the volume of filtering components.
AI power management: optimizing load response and energy efficiency through machine learning.
Wireless power supply: integrates DC-DC and wireless charging reception functions.
Through the above scenario analysis, the technical requirements and commercial demands of DC-DC chips can be accurately matched, helping system design achieve the best balance between energy efficiency, cost, and reliability.