The following is a systematic summary of the conventional packaging of disposable patch fuses:
1、 Mainstream packaging size and characteristics
According to international standards and industry practices, disposable patch fuses can be classified into the following core types based on size:
0402 package (1.0 × 0.5mm)
Application scenarios: Ultra micro devices such as TWS earphones, smartwatch motherboards, and IoT modules with limited space.
Technical features: Rated current 0.05A-2A, withstand voltage usually 32V, low impedance design (<100m Ω) to reduce energy consumption.
0603 package (1.6 × 0.8mm)
Application scenarios: Fast charging circuits for smartphones, portable medical devices (such as blood glucose meters), requiring a balance between volume and breaking capacity.
Technical features: Supports fast/slow break types, with a withstand voltage of up to 63V and strong surge current resistance.
0805 package (2.0 × 1.25mm)
Application scenarios: primary protection for power adapters, industrial control PLC signal terminals, medium power demand scenarios.
Technical features: Maximum rated current of 5A, withstand voltage of 125V, ceramic substrate improves heat dissipation efficiency.
1206 package (3.2 × 1.6mm)
Application scenarios: automotive ECU power protection, 5G base station power module, high reliability requirements field.
Technical features: With a breaking capacity of over 100A and a withstand voltage of 600V, the slow break type can withstand 10 times the pulse current.
1210 package (3.2 × 2.5mm)
Application scenarios: Unmanned aerial vehicle battery management system (BMS), electric tool motor drive.
Technical features: Gold plated electrodes reduce contact resistance and support breaking above 100A.
2410 package (6.1 × 2.5mm)
Application scenarios: DC side protection of photovoltaic inverters, main circuit of industrial frequency converters.
Technical features: withstand voltage of 250VAC/600VDC, anti sulfurization design suitable for harsh environments.
1032 package (10.3 × 3.2mm)
Application scenarios: charging pile output terminal, energy storage system PCS unit, ultra-high current scenario.
Technical features: Rated current up to 30A, slow break type withstand motor starting surge.
2、 Key dimensions for selection
Electrical parameter matching
Voltage: It needs to be 20% higher than the maximum operating voltage of the circuit (such as selecting 24V withstand voltage for car 12V system).
Current: Rated current ≥ 1.25 times steady-state operating current to avoid accidental melting.
Breaking capacity: It must cover the expected short-circuit current (such as industrial motors with>1000A).
Selection of circuit breaker characteristics
Fast break type (FF): response time<1ms, protecting precision ICs from instantaneous short-circuit impact.
Slow break type (TT): can withstand startup surges (such as capacitor charging current), suitable for motor and transformer loads.
Material and Certification Requirements
Substrate: Ceramic packaging with high temperature resistance (>125 ℃), glass fiber has lower cost.
Environmental certification: Export products must comply with RoHS and Reach halogen-free directives.
Vehicle regulation certification: AEC-Q200 certified models are suitable for automotive electronics (such as the 1206 package slow break series).
4、 Industry Trends and Innovation Directions
Miniaturization: 0201 package (0.6 × 0.3mm) is under development, suitable for next-generation devices such as AR glasses.
High voltage resistance: The 1206 package has broken through 1000VDC voltage resistance, serving new energy high-voltage platforms.
Intelligent integration: Fuse+temperature sensor composite packaging, achieving dual protection against overcurrent/overheating.
The selection of disposable patch fuse packaging requires comprehensive consideration of circuit parameters, environmental stress, and certification requirements. 0402/0603 dominates portable devices, while 1206/2410 covers industrial and automotive scenarios. Future technology will evolve towards higher voltage resistance, smaller size, and integrated functionality, providing reliable guarantees for high-density electronic design.
Note: The data in this article is sourced from industry standard packaging libraries, vendor specifications, and application whitepapers.