In depth explanation of Renesas Electronics brand
Brand background and historical evolution
Renesas Electronics Corporation is a leading global semiconductor solutions supplier headquartered in Tokyo, Japan. Its history can be traced back to November 1, 2002, when the semiconductor divisions of NEC Electronics, Hitachi, and Mitsubishi Electric merged to form Renesas Technology. In 2010, Renesas Technology further merged with NEC Electronics to officially establish Renesas Electronics. After multiple integrations and strategic acquisitions, Renesas Electronics has developed into a leading enterprise in the global MCU (microcontroller) and automotive semiconductor fields.
Core technology and product advantages
Core technology areas
Embedded Processing and AI: Provides high-performance MCU, SoC (System on Chip), and AI acceleration solutions, supporting applications such as intelligent gateways, domain controllers, ADAS (Advanced Driver Assistance Systems), etc.
Simulation and power management: covering power management IC, GaN (gallium nitride) power devices, BMS (battery management system) and other technologies, optimizing energy efficiency and system reliability.
Connection and Security: Integrated with wireless communication technologies such as LoRa, Bluetooth, Wi Fi, etc., and certified by ISO/SAE 21434:2021 Automotive Network Security to ensure data security.
Core product series
MCU and SoC:
Automotive grade MCU: RH850 series (32-bit), RL78 series (16th bit), with a global market share of over 30%, firmly ranking first.
R-Car SoC: Supports autonomous driving and intelligent cockpit, providing up to 34TOPS of AI computing power.
Simulation and power devices:
Power management IC: covering AC/DC, DC/DC converters and LDO regulators, supporting industrial and automotive applications.
Discrete components: IGBT, MOSFET, and SiC (silicon carbide) power modules to enhance the efficiency of electric vehicles and charging stations.
Sensors and Security Products:
Pressure sensor: MEMS technology, with an accuracy of ± 0.1% FS, applied in industrial automation.
Security chip: Supports AES-256 encryption and secure boot, compliant with ISO 26262 functional security standards.
Market Position and Industry Certification
Global market leadership position:
MCU market: Ranked first in global market share in 2022 (tied with NXP and Infineon), with a market share of over 30% in automotive MCU.
Automotive Semiconductor: Provides a complete solution from sensors to domain controllers, covering top car companies such as Tesla and Toyota.
Industry certification and standard contributions:
Automotive Network Security: The world's first batch of enterprises to pass ISO/SAE 21434:2021 certification, helping car companies meet UNR155 regulations.
Functional safety: The product has passed the ISO 26262 ASIL-D certification and supports the safety requirements of the auto drive system.
Latest news and strategic direction
Strategic Acquisition and Technology Integration
2016: Acquired Intersil to strengthen power management and simulation technology.
2018: Acquired IDT to expand RF, high-performance timing, and memory interface technologies.
2021: Acquisition of Dialog Semiconductor to enhance analog and mixed signal product capabilities; Acquiring Celeno and laying out Wi Fi 6/6E communication technology.
2024: Acquiring Altium and entering the field of electronic design software to promote end-to-end solutions from chips to systems.
Automotive Electronics Strategy
The "Four Modernizations" route: focusing on networking, intelligence, sharing, and electronicization, providing domain controllers, central computing units, and OTA (remote upgrade) solutions.
Software Defined Automotive: Develop an integrated development environment that supports collaborative development of multiple ECU (Electronic Control Units) to shorten the product launch cycle.
Industrial and IoT Layout
Industrial Automation: Provides motor control, HMI (Human Machine Interface), and predictive maintenance solutions, covering the fields of factory automation and robotics.
Internet of Things: Launched low-power Bluetooth 5.3 and Sub GHz wireless modules, supporting smart home appliances and smart city applications.