JCET Brand Introduction
1、 Company Overview
JCET Group Co., Ltd. was founded in 1972 and is headquartered in Jiangyin, Jiangsu Province, China. It is a leading global provider of integrated circuit manufacturing and technology services, focusing on one-stop solutions for chip manufacturing, including design simulation, wafer testing, packaging testing, product certification, and global direct shipping services. The company has eight production bases and two research and development centers in China, South Korea, and Singapore, and has business organizations in over 20 countries and regions worldwide, providing technical support for fields such as automotive electronics, artificial intelligence, communication, and high-performance computing.
In 2024, with a revenue of US $41.899 billion, Changdian Technology ranked 461 in the Fortune China 500, and remained the third largest manufacturer of finished chip products in the world and the first in Chinese Mainland.
2、 Core technological advantages
Advanced packaging technology
Wafer level packaging (WLP): including embedded wafer level ball grid array (eWLB) and wafer level chip size packaging (WLCSP), supporting high-density interconnection and ultra-thin design.
2.5D/3D integration technology: chip stacking is achieved through silicon via holes (TSV) and fan out packaging (FOWLP) to improve bandwidth and heat dissipation efficiency, and is applied in high-performance computing and storage fields.
System in Package (SiP): Integrating multiple heterogeneous chips and passive components, reducing size and optimizing performance to meet the needs of mobile terminals, the Internet of Things, and automotive electronics.
Innovative manufacturing process
FlexLine ™ Method: Breaking through the traditional wafer diameter limitation, simplifying the supply chain and reducing costs, suitable for fan in/fan out packaging.
Inverted chip packaging: using copper pillar bump technology to improve electrical performance and reliability, widely used in 5G communication and artificial intelligence chips.
3、 Development History and Globalization Layout
Key milestones:
In 1972, the predecessor Jiangyin Transistor Factory was established, embarking on the journey of semiconductor manufacturing.
In 2003, it was listed on the Shanghai Stock Exchange (stock code 600584).
2015: Acquired Singapore based STATS ChipPAC to accelerate global expansion.
2024: The controlling shareholder is changed to Panshi Hong Kong, optimizing the capital structure.
Production base and research and development:
The world's eight major production bases cover China (Jiangyin, Suqian, Chuzhou, etc.), South Korea, and Singapore. The two research and development centers focus on the development of advanced packaging technology, forming a full chain support of "research and development production service".
4、 Market Application and Industry Status
Core application areas
Automotive Electronics: Provides automotive grade packaging solutions with a temperature resistance range of -55 ℃~125 ℃, suitable for onboard control systems and new energy battery management.
Communication and AI: Supports packaging requirements for 5G base stations and high-performance computing chips, such as high bandwidth storage (HBM) and AI accelerators.
Consumer Electronics: Providing miniaturized SiP modules for smartphones and wearable devices to reduce PCB complexity.
Industry recognition and honor
Selected multiple times as one of the "Top 10 Semiconductor Packaging and Testing Enterprises in China", awarded the "Jiangsu Provincial Governor's Quality Award" and the title of "National Technology Innovation Demonstration Enterprise".
Compete for the "IC Billboard Annual Brand Innovation Award" in 2024 to showcase technological influence.
5、 Corporate Social Responsibility and Future Strategy
Social Responsibility:
By 2023, the "Sealed Test Museum" will be built to popularize integrated circuit technology to the public, receive thousands of visitors, and promote industry science popularization and talent cultivation.
Future direction:
Focusing on intelligent manufacturing and green production, we plan to expand high reliability packaging technology in the aerospace and military industries. In 2024, we will collaborate with Allegro MicroSystems to develop localized packaging and testing capabilities for magnetic sensors and power management chips, strengthening our presence in the automotive and industrial markets.
Changdian Technology, with its technological leadership and global production capacity, continues to lead innovation in the semiconductor packaging industry. Its transformation from traditional packaging to high-end microsystem integration not only consolidates its market position, but also provides key technical support for emerging fields such as intelligent terminals and new energy. In the future, with the deepening of 3D integration technology and intelligent manufacturing, Changdian Technology is expected to further expand its influence in the global industrial chain.