Driver IC is an integrated circuit specifically designed to control or drive other electronic components or devices. Its core function is to convert weak control signals (such as PWM signals from MCU) into sufficient power or specific forms of output signals to drive loads (such as motors, LEDs, displays, relays, etc.). It plays the role of a "signal and power conversion bridge" in electronic systems and is widely used in fields such as consumer electronics, industrial control, automotive electronics, and smart devices.
1、 Core functions of driver chip IC
Signal conversion
Convert logic level signals (such as 3.3V/5V) into high voltage/high current signals (such as 12V/5A) to meet load requirements.
Power amplification
Enhance the driving capability of signals to meet the working conditions of high-power devices such as motors and LEDs.
Timing control
Accurately control the switching timing of loads (such as phase switching of stepper motors and scanning frequency of LED matrices).
Protection mechanism
Integrated overcurrent, overvoltage, and overheating protection to prevent damage to the load or chip.
2、 Main types and application scenarios
|Type | Functional Features | Typical Applications | Representative Chips|
|Motor driver IC | Control the speed and direction of DC motors, stepper motors, and brushless motors | Robots, drones, and household appliances (such as fans) | TI DRV8873, ST L298N|
|LED driver IC | Provides constant current/constant voltage output, supports dimming (PWM/analog) | Display backlight, intelligent lighting, headlights | Infineon TLD7002, TI TPS92515|
|Display driver IC | Drivers LCD/OLED pixels, controls grayscale and refresh rate | Mobile phone screens, smartwatches, industrial panels | Synaptics TDDI, Solomon SSD2828|
|Relay/solenoid valve driver IC | Provides high voltage driving capability, isolates control signals from loads | Industrial automation, power systems, smart homes | Toshiba TLP3122, ADI ADUM4223|
|Audio power driver IC | Amplify audio signals to drive speakers or headphones | Sound system, Bluetooth devices, in car entertainment | TPA3116D2, MAX98357A|
|Power management driver IC | Control DC-DC conversion, battery charging and discharging, optimize energy efficiency | Mobile devices, energy storage systems, server power | MPS MP2482, TI BQ25895|
3、 Key performance parameters
Output capability
Voltage range: such as 5V~36V (motor drive), 3V~40V (LED drive).
Current capacity: such as peak current of 5A (for stepper motor drive) and continuous current of 2A (for LED drive).
Control method
Digital interface: SPI/I ² C configuration parameters (such as dimming frequency, dead time).
Analog input: Voltage or PWM signal regulates output strength.
Efficiency and Loss
The switching frequency (such as 200kHz~2MHz) affects the conversion efficiency (>90% is considered efficient design).
The conduction resistance (R<sub>DS (on)</sub>) determines the heat loss, as low as 10m Ω (such as GaN driver IC).
Protection function
Electrical protection: Overcurrent lockout (OCP), short circuit protection (SCP).
Thermal protection: Temperature monitoring and automatic shutdown (TSD).
4、 Typical Circuit Structure
H-bridge drive circuit (motor drive)
By using 4 MOSFETs to form an H-bridge, the direction of current is controlled to achieve forward and reverse rotation of the motor.
Example: L298N drives dual DC motors, supporting logic voltages of 3.3V~5V and load voltages up to 46V
Constant current driving circuit (LED driver)
Use a current mirror or switching regulator to maintain a constant current and avoid fluctuations in LED brightness.
Example: TPS92515 sets the current through an external resistor and supports PWM dimming.
Gate drive circuit (power device drive)
Drive the gate of MOSFET/IGBT to provide fast charging and discharging to reduce switching losses.
Example: IR2104 half bridge driver, compatible with 600V high voltage applications.
5、 Selection and Design Points
Load matching
Voltage/current requirements: Select chips with output capabilities that cover the maximum operating conditions of the load.
Load type: Capacitive/inductive loads need to consider surge current and back electromotive force suppression.
Control interface
Compatibility: Ensure that the input level of the driver IC matches the main control unit (MCU/FPGA).
Function extension: When multiple control channels are required, choose a driver IC that integrates multiple channels
Heat dissipation and environment
Packaging form: TO-220, QFN and other packaging affect the heat dissipation capability, and high-power scenarios require the addition of heat sinks.
Working temperature: Industrial grade (-40~125 ℃) or automotive grade (AEC-Q100 certified) chips are suitable for harsh environments.
6、 Technology Trends
High integration: Integrating driving, protection, and diagnostic functions (such as TI's intelligent gate driver IC).
Wide bandgap semiconductor driver: adapted to the high-frequency and high-voltage requirements of SiC/GaN power devices (such as Infineon EiceDriver) ™）。
Intelligent control: Built in ADC and DSP for real-time feedback regulation (such as digital motor driver IC).
Low power design: The standby current is reduced to µ A, extending the battery life of devices (such as IoT sensor drivers).
The driver chip IC is the "execution center" of electronic systems, and its performance directly affects the response speed, energy efficiency, and reliability of the load. The selection should take into account the load characteristics, control methods, and environmental conditions, while also paying attention to the trend of integrated protection and intelligence. With the development of new energy, automation, and AIoT, high-precision and highly reliable driver ICs will become key supporting technologies.