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- Surface Mount Fuses ,1206 ,10A ,63V ,Time-Lag Type ,Chip ,1206T - 1206T10A63V
- Surface Mount Fuses ,1206 ,1A ,63V ,Time-Lag Type ,Chip ,1206T - 1206T1A63V
- Surface Mount Fuses ,1206 ,2A ,63V ,Time-Lag Type ,Chip ,1206T - 1206T2A63V
- Surface Mount Fuses ,1206 ,4A ,63V ,Time-Lag Type ,Chip ,1206T - 1206T4A63V
- Surface Mount Fuses ,1206 ,5A ,63V ,Time-Lag Type ,Chip ,1206T - 1206T5A63V
- Surface Mount Fuses ,1206 ,7A ,63V ,Time-Lag Type ,Chip ,1206T - 1206T7A63V
- Surface Mount Fuses ,1206 ,8A ,63V ,Time-Lag Type ,Chip ,1206T - 1206T8A63V
- Surface Mount Fuses ,1206 ,1.25A ,63V ,Time-Lag Type ,Chip ,1206T - 1206T1.25A63V
- Surface Mount Fuses ,1206 ,1.5A ,63V ,Time-Lag Type ,Chip ,1206T - 1206T1.5A63V
- Surface Mount Fuses ,1206 ,2.5A ,63V ,Time-Lag Type ,Chip ,1206T - 1206T2.5A63V
- Surface Mount Fuses ,1206 ,3A ,63V ,Time-Lag Type ,Chip ,1206T - 1206T3A63V
- Surface Mount Fuses ,1206 ,3.5A ,63V ,Time-Lag Type ,Chip ,1206T - 1206T3.5A63V
- Surface Mount Fuses ,1206 ,6A ,63V ,Time-Lag Type ,Chip ,1206T - 1206T6A63V
- Surface Mount Fuses ,1206 ,6.3A ,63V ,Time-Lag Type ,Chip ,1206T - 1206T6.3A63V
1206 Slow-Blow SMD Fuse
| Rated Current(ADC)： | 1A 1.25A 1.5A 2A 2.5A 3A 3.5A 4A 5A 6A 6.3A 7A 8A 10A |
| Rated Voltage： | (1A-10A):63V |
| Melting characteristic： | Slow-Blow |
| Safety Approval： | UL：E56092 |
| Breaking Capacity： | V =63V DC ; I=50A |
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| Rated Current(ADC) | 1A 1.25A 1.5A 2A 2.5A 3A 3.5A 4A 5A 6A 6.3A 7A 8A 10A |
| Rated Voltage | (1A-10A):63V |
| Melting characteristic | Slow-Blow |
| Size | 1206(3.2mm*1.6mm) |
| Structure &Material | |
| Substrate | Alumina Ceramic |
| Adhesion layer | Epoxy |
| Fuse element | Cu Alloy / Sn |
| Terminal electrode | Cu / Ni / Sn |
| Protective coating | Flame-retardant epoxy |
| Marking coating | Flame-retardant epoxy |
| Nominal Melting I2 t | I2 t |
| 1A | 0.259 |
| 1.25A | 0.405 |
| 1.5A | 0.583 |
| 2A | 1.036 |
| 2.5A | 1.619 |
| 3A | 2.332 |
| 3.5A | 3.174 |
| 4A | 4.145 |
| 5A | 6.477 |
| 6A | 9.327 |
| 6.3A | 10.283 |
| 7A | 12.696 |
| 8A | 16.582 |
| 10A | 25.909 |
| Environmental Characteristics | |
| Operating Temperature | -55℃～150℃ |
| Storage Conditions | 10℃~40℃ |
| Solder pad size and welding conditions | |
| Preheating | 145 ± 15℃, max. 120 sec |
| Soldering | min. 220℃, max. 60 sec. |
| Maximum temperature | 260±5℃, max. 10sec. |
| Rework Temperature （hot air equipment） | 350℃,3~5seconds |
| Safety Approval | UL：E56092 |
| Breaking Capacity | V =63V DC ; I=50A |
