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- Surface Mount Fuses ,1206 ,3.0A ,63V ,Fast Acting Type ,Chip ,1206F - 1206F3A63V
- Surface Mount Fuses ,1206 ,10A ,63V ,Fast Acting Type ,Chip ,1206F - 1206F10A63V
- Surface Mount Fuses ,1206 ,1A ,63V ,Fast Acting Type ,Chip ,1206F - 1206F1A63V
- Surface Mount Fuses ,1206 ,1.25A ,63V ,Fast Acting Type ,Chip ,1206F - 1206F1.25A63V
- Surface Mount Fuses ,1206 ,1.5A ,63V ,Fast Acting Type ,Chip ,1206F - 1206F1.5A63V
- Surface Mount Fuses ,1206 ,1.75A ,63V ,Fast Acting Type ,Chip ,1206F - 1206F1.75A63V
- Surface Mount Fuses ,1206 ,2.0A ,63V ,Fast Acting Type ,Chip ,1206F - 1206F2A63V
- Surface Mount Fuses ,1206 ,2.5A ,63V ,Fast Acting Type ,Chip ,1206F - 1206F2.5A63V
- Surface Mount Fuses ,1206 ,3.5A ,63V ,Fast Acting Type ,Chip ,1206F - 1206F3.5A63V
- Surface Mount Fuses ,1206 ,4.0A ,63V ,Fast Acting Type ,Chip ,1206F - 1206F4A63V
- Surface Mount Fuses ,1206 ,5.0A ,63V ,Fast Acting Type ,Chip ,1206F - 1206F5A63V
- Surface Mount Fuses ,1206 ,6.0A ,63V ,Fast Acting Type ,Chip ,1206F - 1206F6A63V
- Surface Mount Fuses ,1206 ,7.0A ,63V ,Fast Acting Type ,Chip ,1206F - 1206F7A63V
- Surface Mount Fuses ,1206 ,8.0A ,63V ,Fast Acting Type ,Chip ,1206F - 1206F8A63V
- Surface Mount Fuses ,1206 ,500mA ,125V ,Fast Acting Type ,Chip SMD ,WALTER-1206F ,- - 1206F0.5A125V
- Surface Mount Fuses ,1206 ,750mA ,63V ,Fast Acting Type ,Chip SMD ,WALTER-1206F ,- - 1206F0.75A63V
- Surface Mount Fuses ,1206 ,2.0A ,63V ,Fast Acting Type ,Chip ,WALTER-1206F ,- - F93-F-2A000-063
- Surface Mount Fuses ,1206 ,375mA ,125V ,Fast Acting Type ,Chip SMD - 1206F0.375A125V
- Surface Mount Fuses ,1206 ,630mA ,125V ,Fast Acting Type ,Chip SMD ,WALTER-1206F ,- - 1206F0.63A125V
1206 Fast Acting Type Surface Mount Fuses
| Rated Current： | 0.375A-10A |
| Rated Voltage： | (0.375A-0.75A):125V (1A-10A):63V |
| Melting characteristic： | Fast Acting |
| Breaking Capacity： | V =63V DC ; I=50A |
| Safety Approval： | UL：E56092 |
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| Rated Current | 0.375A-10A |
| Rated Voltage | (0.375A-0.75A):125V (1A-10A):63V |
| Melting characteristic | Fast Acting |
| Size | 1206(3.2mm*1.6mm) |
| Substrate | Alumina Ceramic |
| Adhesion layer | Epoxy |
| Fuse element | Cu Alloy / Sn |
| Terminal electrode | Cu / Ni / Sn |
| Protective coating | Flame-retardant epoxy |
| Marking coating | Flame-retardant epoxy |
| Safety Approval | UL：E56092 |
| Operating Temperature | -55℃～150℃ |
| Storage Conditions | 10℃~40℃ |
| Solder pad size and welding conditions | |
| Preheating | 145 ± 15℃, max. 120 sec |
| Soldering | min. 220℃, max. 60 sec. |
| Maximum temperature | 260±5℃, max. 10sec. |
| Rework Temperature （hot air equipment） | 350℃,3~5seconds |
| Breaking Capacity | V =63V DC ; I=50A |
| Safety Approval | UL：E56092 |
